Senior Packaging Development Engineer (Microelectronics/Photonics) Jobs in Oxford, United Kingdom

The future is quantum. Oxford Ionics is a high-performance quantum computing company delivering world-leading innovations to create the most powerful, accurate and reliable quantum computers to solve the world's most important problems. Quantum Computing offers a radically new way of building computers that harnesses the power of quantum physics to outperform conventional supercomputers exponentially. Using our unique trapped-ion technology, we are at the forefront of the race to unleash the real potential of quantum computing.What to expectThe Senior Packaging Development Engineer will lead the packaging technology development for the quantum processor unit within the Quantum Processor Engineering team. The packaging facilitates the required mechanical, electrical, thermal and optical interconnections to the chip. The Quantum Processor Engineering team is responsible for delivering the hardware technologies needed for our ion-trapping quantum processor unit forming the heart of the quantum computer. The quantum processor unit comprises an electrical (and photonic) chip and packaging.What you’ll be responsible for You will be responsible for leading the packaging technology development for the quantum processor unit consisting of an electrical (and photonic) chip and packaging. Working with internal stakeholders and other functions in the Quantum Processor Engineering team, you’ll help to translate scientific requirements of low-volume cryogenic packaging technology into measurable specifications. You will also lead the specification, design and verification of each packaging step, including die bond, wire bond, test and fibre alignment and design and execute a program of work to derisk technology development. Additional responsibilities include:Ownership of specification, procurement and verification of required piece parts with suppliersDesigning, supervising and carrying out root-cause and failure analysis experimentsHands-on prototyping of packaging processesPreparation of packaging design documentation (detail design, decision pathway, design rules, performance specification, procurement specifications)Arrange and coordinate regular packaging assembly runs to provide prototype devices: including managing stock of parts and supplier slots from forecast stakeholder requirements.

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